lx5553 p roduction d ata s heet microsemi analog mixed signal group 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 1 w w w . m i c r o s e m i . c o m 2.4-2.5 ghz front-end module with internally matched power amplifier, lna & sp3t switch tm ? copyright ? 2010 rev. 1.0, 2010-03-18 d e s c r i p t i o n lx5553 is a high-integration, high- performance wlan front-end module (fem) for 802.11b/g/n and other applications in the 2.4-2.5ghz frequency range. lx5553 integrates an advanced ingap/gaas hetero- junction bipolar transistor (hbt) power amplifier with on chip impedance matching, a fully matched low noise amplifier based on ingaas enhancement mode pseudo-morphic high electron mobility transistor (e- phemt) technology, and a depletion mode phemt (d-phemt) single- pole triple-throw (sp3t) switch, all into a single package with 3x3mm footprint. lx5553 provides capability of sharing a single antenna between wlan and bluetooth systems through the sp3t switch. the tx path of lx5553 features a two-stage monolithic microwave integrated circuit (mmic) power amplifier with active bias circuitry, on-chip output power detector, and 50 ? input/output matching inside the package. with 3.6v supply voltage and 82ma bias current, the tx path provides about 25db power gain, and +17dbm linear output power, with evm (<3%) for 64qam/ 54mbps ofdm. both gain and power are readily measured at antenna port, with the insertion loss of the sp3t switch included. the rx path of lx5553 features 13db small-signal gain, noise figure of 2.1db, and high input referred third- order harmonic intercept point (iip3) of +5dbm, including the sp3t switch loss. the lna consumes about 11ma current with a single 3.6v supply. the bluetooth path of lx5553 features low insertion loss of 0.9db and high input referred 1db gain compression point (ip 1db ) of +29dbm. lx5553 is available in a 16-pin, low profile of 0.55mm, 3x3mm 2 micro-lead package (mlpq-16l) in very low profile of 0.55mm. with its high level of functional integration, best-class performance, compact footprint and low profile, lx5553 offers an ideal front- end solution for the ever demanding design requirements of today?s highly integrated mobile equipments, including 802.11b/g/n and bluetooth applications. important: for the most current data, consult microsemi ?s website: http://www.microsemi.com k e y f e a t u r e s ? 2.4-2.5ghz 802.11b/g/n front- end solution in a single mlp package ? sp3t for sharing antenna between wlan and bluetooth systems ? all rf i/o matched to 50 ? ? single-supply voltage 3.0v to 4.2v ? small footprint: 3x3mm 2 ? low profile: 0.55mm ? rohs compliant & pb-free tx features : ? power gain ~ 25 db* ? pout ~ +17 dbm* for 3% evm at antenna ? current ~145 ma at +17 dbm* ? pout ~ +21 dbm* for 11b 1mbps dsss mask compliance ? quiescent current ~ 82 ma rx features : ? gain ~ 13 db* ? noise figure ~ 2.1 db* ? iip3 ~ +5 dbm* bluetooth path : ? insertion loss ~ 0.9 db ? ip1db ~ +29 dbm * including sp3t switch loss a p p l i c a t i o n s ? ieee 802.11b/g/n ? mobile phone wlan module b l o c k d i a g r a m l l x x 5 5 5 5 5 5 3 3 *imn: input matching network *omn: output matching network vref txin antenna port vc1 det ctrltx / ctrlrx / ctrlbt vdd lnaout omn* imn* pa paout/ vc2 swin bt lna *imn: input matching network *omn: output matching network vref txin antenna port vc1 det ctrltx / ctrlrx / ctrlbt vdd lnaout omn* imn* pa paout/ vc2 swin bt lna
lx5553 p roduction d ata s heet microsemi analog mixed signal group 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 2 w w w . m i c r o s e m i . c o m 2.4-2.5 ghz front-end module with internally matched power amplifier, lna & sp3t switch tm ? copyright ? 2010 rev. 1.0, 2010-03-18 p r o d u c t h i g h l i g h t a b s o l u t e m a x i m u m r a t i n g s dc supply voltage, rf off................................................................................5v collector current (pa)................................................................................500ma drain current (lna) ....................................................................................40ma total power dissipation....................................................................................2w rf input power (txin) ............................................................................+10 dbm rf input power (ant, swin, bt) ............................................................+25 dbm maximum junction temperature (tj max) ................................................ +150c operation ambient temperature ...................................................-40c to +85c storage temperature ....................................................................-65c to +150c rohs/pb-free peak package temp. for solder reflow (40 seconds maximum exposure)................................................... 260c (+0, -5) note: exceeding these ratings could cause damage to the device. all voltages are with respect to ground. currents are positive into, negative out of specified terminal . t h e r m a l d a t a lu plastic mlpq 16-pin thermal resistance - junction to c ase , ? jc 10 c/w thermal resistance - junction to a mbient , ? ja 50 c/w junction temperature calculation: t j = t a + (p d x ? ja ). the ? ja numbers are guidelines for the thermal performance of the device/pc-board system. all of the above assume no ambient airflow. p a c k a g e p i n o u t lq p ackage (?see-through? view from top) rohs/pb-free 100% matte tin lead finish p a c k a g e o r d e r i n f o lu plastic mlpq 16 pin 3x3mm rohs compliant /pb-free lx5553lu note: available in tape & reel. append the letters ?tr? to the part number. (i.e. LX5553LU-TR) msc 5552 818a msc 5553 845a msc 5552 818a msc 5553 845a vcc 1 2 3 9 12 11 10 4 5 6 7 8 13 14 15 16 vref det lnaout paout swin ctrlrx ctrltx vdd bt ctrlbt ant txin vc1 vc2 nc gnd vcc 1 2 3 9 12 11 10 4 5 6 7 8 13 14 15 16 vref det lnaout paout swin ctrlrx ctrltx vdd bt ctrlbt ant txin vc1 vc2 nc gnd p p a a c c k k a a g g e e d d a a t t a a
lx5553 p roduction d ata s heet microsemi analog mixed signal group 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 3 w w w . m i c r o s e m i . c o m 2.4-2.5 ghz front-end module with internally matched power amplifier, lna & sp3t switch tm ? copyright ? 2010 rev. 1.0, 2010-03-18 thank you for your interest in microsemi ? analog mixed signal products. the full data sheet for this device contains proprietary information. to obtain a copy, please contact your local microsemi sales representative. the name of your local representative can be obtained at the following link http://www.microsemi.com/contact/contactfind.asp or contact us directly by sending an email to: ipgdatasheets@microsemi.com be sure to specify the data sheet you are requesting and include your company name and contact information and or vcard. we look forward to hearing from you.
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